Kim, M.; Jang, S.; Choi, S.; Yang, J.; Kim, J.; Choi, D.
Analysis of Shape Memory Behavior and Mechanical Properties of Shape Memory Polymer Composites Using Thermal Conductive Fillers. Micromachines 2021, 12, 1107.
https://doi.org/10.3390/mi12091107
AMA Style
Kim M, Jang S, Choi S, Yang J, Kim J, Choi D.
Analysis of Shape Memory Behavior and Mechanical Properties of Shape Memory Polymer Composites Using Thermal Conductive Fillers. Micromachines. 2021; 12(9):1107.
https://doi.org/10.3390/mi12091107
Chicago/Turabian Style
Kim, Mijeong, Seongeun Jang, Sungwoong Choi, Junghoon Yang, Jungpil Kim, and Duyoung Choi.
2021. "Analysis of Shape Memory Behavior and Mechanical Properties of Shape Memory Polymer Composites Using Thermal Conductive Fillers" Micromachines 12, no. 9: 1107.
https://doi.org/10.3390/mi12091107
APA Style
Kim, M., Jang, S., Choi, S., Yang, J., Kim, J., & Choi, D.
(2021). Analysis of Shape Memory Behavior and Mechanical Properties of Shape Memory Polymer Composites Using Thermal Conductive Fillers. Micromachines, 12(9), 1107.
https://doi.org/10.3390/mi12091107