Kim, J.; Kim, B.-Y.; Park, S.D.; Seo, J.-H.; Lee, C.-J.; Yoo, M.J.; Kim, Y.
Mechanical Durability of Flexible Printed Circuit Boards Containing Thin Coverlays Fabricated with Poly(Amide-Imide-Urethane)/Epoxy Interpenetrating Networks. Micromachines 2021, 12, 943.
https://doi.org/10.3390/mi12080943
AMA Style
Kim J, Kim B-Y, Park SD, Seo J-H, Lee C-J, Yoo MJ, Kim Y.
Mechanical Durability of Flexible Printed Circuit Boards Containing Thin Coverlays Fabricated with Poly(Amide-Imide-Urethane)/Epoxy Interpenetrating Networks. Micromachines. 2021; 12(8):943.
https://doi.org/10.3390/mi12080943
Chicago/Turabian Style
Kim, Jeongah, Bo-Young Kim, Seong Dae Park, Ji-Hun Seo, Chan-Jae Lee, Myong Jae Yoo, and Youngmin Kim.
2021. "Mechanical Durability of Flexible Printed Circuit Boards Containing Thin Coverlays Fabricated with Poly(Amide-Imide-Urethane)/Epoxy Interpenetrating Networks" Micromachines 12, no. 8: 943.
https://doi.org/10.3390/mi12080943
APA Style
Kim, J., Kim, B.-Y., Park, S. D., Seo, J.-H., Lee, C.-J., Yoo, M. J., & Kim, Y.
(2021). Mechanical Durability of Flexible Printed Circuit Boards Containing Thin Coverlays Fabricated with Poly(Amide-Imide-Urethane)/Epoxy Interpenetrating Networks. Micromachines, 12(8), 943.
https://doi.org/10.3390/mi12080943