Feng, X.; Xu, B.; Lei, J.; Wu, X.; Luo, F.; Fu, L.
Elimination of Hole Mouth Burr in Multilayer PCB Micro-Hole by Using Micro-EDM. Micromachines 2021, 12, 688.
https://doi.org/10.3390/mi12060688
AMA Style
Feng X, Xu B, Lei J, Wu X, Luo F, Fu L.
Elimination of Hole Mouth Burr in Multilayer PCB Micro-Hole by Using Micro-EDM. Micromachines. 2021; 12(6):688.
https://doi.org/10.3390/mi12060688
Chicago/Turabian Style
Feng, Xinke, Bin Xu, Jianguo Lei, Xiaoyu Wu, Feng Luo, and Lianyu Fu.
2021. "Elimination of Hole Mouth Burr in Multilayer PCB Micro-Hole by Using Micro-EDM" Micromachines 12, no. 6: 688.
https://doi.org/10.3390/mi12060688
APA Style
Feng, X., Xu, B., Lei, J., Wu, X., Luo, F., & Fu, L.
(2021). Elimination of Hole Mouth Burr in Multilayer PCB Micro-Hole by Using Micro-EDM. Micromachines, 12(6), 688.
https://doi.org/10.3390/mi12060688