Wolter, S.; Linek, J.; Altmann, J.; Weimann, T.; Bechstein, S.; Kleiner, R.; Beyer, J.; Koelle, D.; Kieler, O.
Fabrication Process for Deep Submicron SQUID Circuits with Three Independent Niobium Layers. Micromachines 2021, 12, 350.
https://doi.org/10.3390/mi12040350
AMA Style
Wolter S, Linek J, Altmann J, Weimann T, Bechstein S, Kleiner R, Beyer J, Koelle D, Kieler O.
Fabrication Process for Deep Submicron SQUID Circuits with Three Independent Niobium Layers. Micromachines. 2021; 12(4):350.
https://doi.org/10.3390/mi12040350
Chicago/Turabian Style
Wolter, Silke, Julian Linek, Josepha Altmann, Thomas Weimann, Sylke Bechstein, Reinhold Kleiner, Jörn Beyer, Dieter Koelle, and Oliver Kieler.
2021. "Fabrication Process for Deep Submicron SQUID Circuits with Three Independent Niobium Layers" Micromachines 12, no. 4: 350.
https://doi.org/10.3390/mi12040350
APA Style
Wolter, S., Linek, J., Altmann, J., Weimann, T., Bechstein, S., Kleiner, R., Beyer, J., Koelle, D., & Kieler, O.
(2021). Fabrication Process for Deep Submicron SQUID Circuits with Three Independent Niobium Layers. Micromachines, 12(4), 350.
https://doi.org/10.3390/mi12040350