Next Article in Journal
A Microfluidic Device for Automated High Throughput Detection of Ice Nucleation of Snomax®
Next Article in Special Issue
Study of the Absorption of Electromagnetic Radiation by 3D, Vacuum-Packaged, Nano-Machined CMOS Transistors for Uncooled IR Sensing
Previous Article in Journal
Development of Skin-On-A-Chip Platforms for Different Utilizations: Factors to Be Considered
Previous Article in Special Issue
A Hybrid Fuzzy Decision Model for Evaluating MEMS and IC Integration Technologies
 
 

Order Article Reprints

Journal: Micromachines, 2021
Volume: 12
Number: 295

Article: Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging
Authors: by Pao-Hsiung Wang, Yu-Wei Huang and Kuo-Ning Chiang
Link: https://www.mdpi.com/2072-666X/12/3/295

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop