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Journal: Micromachines, 2021
Volume: 12
Number: 169

Article: A RF Redundant TSV Interconnection for High Resistance Si Interposer
Authors: by Mengcheng Wang, Shenglin Ma, Yufeng Jin, Wei Wang, Jing Chen, Liulin Hu and Shuwei He
Link: https://www.mdpi.com/2072-666X/12/2/169

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