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Journal: Micromachines, 2021
Volume: 12
Number: 1586

Article: Wafer-Level 3D Integration Based on Poly (Diallyl Phthalate) Adhesive Bonding
Authors: by Zhong Fang, Peng You, Yijie Jia, Xuchao Pan, Yunlei Shi, Junjie Jiao and Yong He
Link: https://www.mdpi.com/2072-666X/12/12/1586

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