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Journal: Micromachines, 2021
Volume: 12
Number: 1331

Article: Dual Laser Beam Asynchronous Dicing of 4H-SiC Wafer
Authors: by Zhe Zhang, Zhidong Wen, Haiyan Shi, Qi Song, Ziye Xu, Man Li, Yu Hou and Zichen Zhang
Link: https://www.mdpi.com/2072-666X/12/11/1331

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