Precision EDM of Micron-Scale Diameter Hole Array Using in-Process Wire Electro-Discharge Grinding High-Aspect-Ratio Microelectrodes

Micro-electrical discharge machining (micro-EDM) is a good candidate for processing micro-hole arrays, which are critical features of micro-electro-mechanical systems (MEMS), diesel injector nozzles, inkjet printheads and turbine blades, etc. In this study, the wire vibration of the wire electro-discharge grinding (WEDG) system has been analyzed theoretically, and, accordingly, an improved WEDG method was developed to fabricate micron-scale diameter and high-aspect-ratio microelectrodes for the in-process micro-EDM of hole array with hole diameter smaller than 20 μm. The improved method has a new feature of a positioning device to address the wire vibration problem, and thus to enhance microelectrodes fabrication precision. Using this method, 14 μm diameter microelectrodes with less than 0.4 μm deviation and an aspect ratio of 142, which is the largest aspect ratio ever reported in the literature, were successfully fabricated. These microelectrodes were then used to in-process micro-EDM of hole array in stainless steel. The effects of applied voltage, current and pulse frequency on hole dimensional accuracy and microelectrode wear were investigated. The optimal processing parameters were selected using response–surface experiments. To improve machining accuracy, an in-process touch-measurement compensation strategy was applied to reduce the cumulative compensation error of the micro-EDM process. Using such a system, micro-hole array (2 × 80) with average entrance diameter 18.91 μm and average exit diameter 17.65 μm were produced in 50 μm thickness stainless steel sheets, and standard deviations of hole entrance and exit sides of 0.44 and 0.38 μm, respectively, were achieved.