Article Versions Notes

Roshanghias A, Dreissigacker M, Scherf C, Bretthauer C, Rauter L, Zikulnig J, Braun T, Becker K-F, Rzepka S, Schneider-Ramelow M. On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers. Micromachines. 2020; 11(6):564. https://doi.org/10.3390/mi11060564

Roshanghias, Ali, Marc Dreissigacker, Christina Scherf, Christian Bretthauer, Lukas Rauter, Johanna Zikulnig, Tanja Braun, Karl-F. Becker, Sven Rzepka, and Martin Schneider-Ramelow. 2020. "On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers" Micromachines 11, no. 6: 564. https://doi.org/10.3390/mi11060564

Roshanghias, A., Dreissigacker, M., Scherf, C., Bretthauer, C., Rauter, L., Zikulnig, J., Braun, T., Becker, K.-F., Rzepka, S., & Schneider-Ramelow, M. (2020). On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers. Micromachines, 11(6), 564. https://doi.org/10.3390/mi11060564