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Journal: Micromachines, 2020
Volume: 11
Number: 564
564
Article: On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers
Authors: by Ali Roshanghias, Marc Dreissigacker, Christina Scherf, Christian Bretthauer, Lukas Rauter, Johanna Zikulnig, Tanja Braun, Karl-F. Becker, Sven Rzepka and Martin Schneider-Ramelow
Link: https://www.mdpi.com/2072-666X/11/6/564

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