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Journal: MicromachinesVolume: 11Number: 564
Article: On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers
- Authors:
- Ali Roshanghias1,*,
- Marc Dreissigacker2 and
- Christina Scherf3,4
- et al.
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