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Journal: MicromachinesVolume: 11Number: 1060
Article: Thermal Impedance Characterization Using Optical Measurement Assisted by Multi-Physics Simulation for Multi-Chip SiC MOSFET Module
  • Authors:
  • Min-Ki Kim and
  • Sang Won Yoon*
Link: https://www.mdpi.com/2072-666X/11/12/1060

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