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Journal: Micromachines, 2020
Volume: 11
Number: 1060

Article: Thermal Impedance Characterization Using Optical Measurement Assisted by Multi-Physics Simulation for Multi-Chip SiC MOSFET Module
Authors: by Min-Ki Kim and Sang Won Yoon
Link: https://www.mdpi.com/2072-666X/11/12/1060

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