The technology of picking up microcomponents plays a decisive role in the assembly of complex systems in micro- and nanoscale. The traditional method of picking up microcomponents with a mechanical manipulation tool can easily cause irreversible damage to the object, and only one object can be manipulated at a time. Furthermore, it is difficult to release the object with this method, and the release location is not accurate. With the aim of solving the above problems, the present study proposes an electrochemistry-based method for picking up metal microcomponents. First, the effect of ambient relative humidity on pickup was analyzed, and the effect of current density and electrolyte concentration on the deposition was examined. Then, a force analysis in the process of manipulation was carried out. Through the analysis of influence factors, the ideal experimental parameters were obtained theoretically. Finally, a simulation was carried out with COMSOL Multiphysics based on the above analysis. Copper microwires with a diameter of 60 μm and lengths of 300, 500, and 700 μm were successfully picked up and released using a pipette with a nozzle diameter of 15 μm. Compared with the traditional method, this method is simple to manipulate. Furthermore, it has a high success rate, causes less damage to the object, and good releasing accuracy.
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