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Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon

College of Mechanical Engineering and Automation, Huaqiao University, Xiamen 361021, China
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Micromachines 2019, 10(9), 616; https://doi.org/10.3390/mi10090616
Received: 14 August 2019 / Revised: 2 September 2019 / Accepted: 13 September 2019 / Published: 16 September 2019
(This article belongs to the Section D:Materials and Processing)
Monocrystalline silicon is an important semiconductor material and occupies a large part of the market demand. However, as a hard-brittle material, monocrystalline silicon is extremely prone to happen edge chipping during sawing processing. The edge chipping seriously affects the quality and performance of silicon wafers. In this paper, both conventional and ultrasonicassisted sawing tests were carried out on monocrystalline silicon to study the formation mechanism of edge chipping. The shape and size of edge chipping after sawing process were observed and measured. The experimental results demonstrated that different sawing processes present different material removal modes and edge quality. The mode of crack propagation was continuous cracks in conventional sawing process, while the expansion mode in ultrasonic assisted sawing was blasting microcracks. This results in the cutting force of ultrasonic assisted sawing becomes much smaller than that of conventional sawing process, which can reduce the size of edge chipping and improve the quality of machined surface. View Full-Text
Keywords: monocrystalline silicon; ultrasonic assisted sawing; edge chipping; edge chipping mechanism monocrystalline silicon; ultrasonic assisted sawing; edge chipping; edge chipping mechanism
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MDPI and ACS Style

Shen, J.; Zhu, X.; Chen, J.; Tao, P.; Wu, X. Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon. Micromachines 2019, 10, 616.

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