Submit to this Journal Review for this Journal Propose a Special Issue

Article Menu

Order Article Reprints

Journal: Micromachines, 2019
Volume: 10
Number: 342
342
Article: Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration
Authors: by Tanja Braun, Karl-Friedrich Becker, Ole Hoelck, Steve Voges, Ruben Kahle, Marc Dreissigacker and Martin Schneider-Ramelow
Link: https://www.mdpi.com/2072-666X/10/5/342

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Number of pages ^req

Copies ^req

Destination Country / Region ^req

Reprint Price

Shipment Price

Total Estimated Price

Total Estimated Price Incl. VAT

Shipping Address

First Name ^req

Last Name ^req

E-mail Address ^req

Phone Number ^req

VAT / Reference No.

Company / Institute

Address (P.O. box cannot be used) ^req

Post Code ^req

City ^req

State (mandatory for USA)

Destination Country / Region

Billing Address

Same as Shipping Address

First Name ^req

Last Name ^req

E-mail Address ^req

Phone Number

Company / Institute

Address ^req

Post Code ^req

City ^req

State (mandatory for USA)

Country / Region ^req

Notes or Comments

Comments

Validate and Place Order

^req

The order must be prepaid after it is placed

^req denotes required fields.

Article Menu

Order Article Reprints

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

Further Information

Guidelines

MDPI Initiatives

Follow MDPI