Wu, K.; Zhou, Q.; Zou, H.; Leng, K.; Zeng, Y.; Wu, Z.
High Precision Thermoforming 3D-Conformable Electronics with a Phase-Changing Adhesion Interlayer. Micromachines 2019, 10, 160.
https://doi.org/10.3390/mi10030160
AMA Style
Wu K, Zhou Q, Zou H, Leng K, Zeng Y, Wu Z.
High Precision Thermoforming 3D-Conformable Electronics with a Phase-Changing Adhesion Interlayer. Micromachines. 2019; 10(3):160.
https://doi.org/10.3390/mi10030160
Chicago/Turabian Style
Wu, Kang, Qifeng Zhou, Huaping Zou, Kangmin Leng, Yifan Zeng, and Zhigang Wu.
2019. "High Precision Thermoforming 3D-Conformable Electronics with a Phase-Changing Adhesion Interlayer" Micromachines 10, no. 3: 160.
https://doi.org/10.3390/mi10030160
APA Style
Wu, K., Zhou, Q., Zou, H., Leng, K., Zeng, Y., & Wu, Z.
(2019). High Precision Thermoforming 3D-Conformable Electronics with a Phase-Changing Adhesion Interlayer. Micromachines, 10(3), 160.
https://doi.org/10.3390/mi10030160