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Journal: Micromachines, 2019
Volume: 10
Number: 15

Article: Research on Wafer-Level MEMS Packaging with Through-Glass Vias
Authors: by Fan Yang, Guowei Han, Jian Yang, Meng Zhang, Jin Ning, Fuhua Yang and Chaowei Si
Link: https://www.mdpi.com/2072-666X/10/1/15

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