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Journal: Micromachines, 2019
Volume: 10
Number: 15
Article:
Research on Wafer-Level MEMS Packaging with Through-Glass Vias
Authors:
by
Fan Yang, Guowei Han, Jian Yang, Meng Zhang, Jin Ning, Fuhua Yang and Chaowei Si
Link:
https://www.mdpi.com/2072-666X/10/1/15
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