In this paper, the electrospray technology is used to easily deposit the glass frit into patterns at a micro-scale level. First, far-field electrospray process was carried out with a mixture of glass frit in the presence of ethanol. A uniform, smooth, and dense glass frit film was obtained, verifying that the electrospray technology was feasible. Then, the distance between the nozzle and the substrate was reduced to 2 mm to carry out near-field electrospray. The experimental process was improved by setting the range of the feed rate of the substrate to match both the concentration and the flow rate of the solution. Spray diameter could be less at the voltage of 2 kV, in which the glass frit film was expected to reach the minimum line width. A uniform glass frit film with a line width within the range of 400–500 μm was prepared when the speed of the substrate was 25 mm/s. It indicates that electrospray is an efficient technique for the patterned deposition of glass frit in wafer-level hermetic encapsulation.
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