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Recent Developments in Halogen Free Flame Retardants for Epoxy Resins for Electrical and Electronic Applications

Institute of Technical Chemistry, Karlsruhe Institute of Technology, Hermann-von-Helmholtz Platz 1, 76344 Eggenstein-Leopoldshafen, Germany
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Materials 2010, 3(8), 4300-4327; https://doi.org/10.3390/ma3084300
Received: 2 July 2010 / Revised: 4 August 2010 / Accepted: 6 August 2010 / Published: 11 August 2010
(This article belongs to the Special Issue Flame Retardants)
The recent implementation of new environmental legislations led to a change in the manufacturing of composites that has repercussions on printed wiring boards (PWB). This in turn led to alternate processing methods (e.g., lead-free soldering), which affected the required physical and chemical properties of the additives used to impart flame retardancy. This review will discuss the latest advancements in phosphorus containing flame retardants for electrical and electronic (EE) applications and compare them with commercially available ones. The mechanism of degradation and flame retardancy of phosphorus flame retardants in epoxy resins will also be discussed. View Full-Text
Keywords: epoxy; fire retardant; phosphorus, printed wiring boards; composites epoxy; fire retardant; phosphorus, printed wiring boards; composites
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Rakotomalala, M.; Wagner, S.; Döring, M. Recent Developments in Halogen Free Flame Retardants for Epoxy Resins for Electrical and Electronic Applications. Materials 2010, 3, 4300-4327.

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