Szczotka, N.; Nashashibi, S.; Motyka, A.; Drozdek, S.; Leuthold, J.; Malecha, K.
Ultra-Precise Dispensing for Rapid and Flexible Through-Silicon Via Filling. Materials 2026, 19, 1861.
https://doi.org/10.3390/ma19091861
AMA Style
Szczotka N, Nashashibi S, Motyka A, Drozdek S, Leuthold J, Malecha K.
Ultra-Precise Dispensing for Rapid and Flexible Through-Silicon Via Filling. Materials. 2026; 19(9):1861.
https://doi.org/10.3390/ma19091861
Chicago/Turabian Style
Szczotka, Nina, Shadi Nashashibi, Aleksandra Motyka, Sławomir Drozdek, Juerg Leuthold, and Karol Malecha.
2026. "Ultra-Precise Dispensing for Rapid and Flexible Through-Silicon Via Filling" Materials 19, no. 9: 1861.
https://doi.org/10.3390/ma19091861
APA Style
Szczotka, N., Nashashibi, S., Motyka, A., Drozdek, S., Leuthold, J., & Malecha, K.
(2026). Ultra-Precise Dispensing for Rapid and Flexible Through-Silicon Via Filling. Materials, 19(9), 1861.
https://doi.org/10.3390/ma19091861