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Journal: Materials, 2026
Volume: 19
Number: 2897
Article:
Ultrasonic Soldering of AlN/Cu Using SiC-Modified Zn5Al3Ti Active Solder
Authors:
by
Tomas Melus, Roman Kolenak, Mikulas Sloboda, Peter Gogola and Matej Pasak
Link:
https://www.mdpi.com/1996-1944/19/13/2897
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