High-Entropy Alloys: A Review of Emerging Sensing Materials for Next-Generation Flexible Electronics
Highlights
- HEAs provide a promising material platform for next-generation flexible electronics requiring high durability and reliability.
- Composition and microstructure engineering of HEAs open new pathways for high-performance, selective, and long-lasting sensors.
- Integration of HEAs into wearable and intelligent monitoring systems could significantly advance personalized healthcare and environmental safety.
Abstract
1. Introduction
2. High-Entropy Alloys as Sensing Materials
2.1. Tailoring the Mechanical Properties of HEAs

2.2. Tailoring the Electrical Properties of HEAs

2.3. Tailoring the Electrocatalytic Properties of HEAs
3. Controllable Fabrication of HEA Micro/Nano Structures
3.1. HEA Core Processes for HEA-Based Flexible Sensor Sensitive Layers
3.1.1. Mechanical Alloying
3.1.2. Wet-Chemical Synthesis
3.1.3. Non-Equilibrium Synthesis
3.2. Comparison of Different Fabrication Processes and Their Suitability for Flexible Applications
4. Applications of HEA-Based Flexible Sensors
4.1. HEA-Based Flexible Strain/Stress Sensors
4.2. HEA-Based Gas Sensors
4.3. HEA-Based Electrochemical Sensors
5. Discussion and Outlook
5.1. Comparison of HEAs with Conventional Alloys
5.2. Current Challenges for HEA-Based Sensors
5.3. Future Outlook
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Acknowledgments
Conflicts of Interest
Abbreviations
| HEAs | High-Entropy Alloys |
| TCR | Temperature Coefficient of Resistance |
| HER | Hydrogen Evolution Reaction |
| ORR | Oxygen Reduction Reaction |
| OER | Oxygen Evolution Reaction |
| UOR | Urea Oxidation Reaction |
| PEC | Photoelectrochemical |
| MOF | Metal–Organic Framework |
| DFT | Density Functional Theory |
| MD | Molecular Dynamics |
| ECT | Electric Current Treatment |
| FCC | Face-Centered Cubic |
| BCC | Body-Centered Cubic |
| GF | Gauge Factor |
| LOD | Limit of Detection |
| ML | Machine Learning |
| MWCNTs | Multi-Walled Carbon Nanotubes |
| PDMS | Polydimethylsiloxane |
| PI | Polyimide |
| PET | Polyethylene Terephthalate |
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| Alloy Composition | Key Advantages | Main Limitations | Ref. |
|---|---|---|---|
| Magnetron Sputtering | Excellent film uniformity; precise composition control; compatible with photolithography; high consistency | High equipment investment; low material utilization (planar targets); challenges with curved/irregular flexible substrates | [63,70,71] |
| Laser Melting/Additive Manufacturing | Rapid prototyping; capable of forming complex 3D structures; unique for mold preparation | High heat input limits direct application on flexible substrates; currently more suitable as an intermediate step | [31,72,73] |
| Electrospinning | Fabricates ultra-fine nanoscale fibers; large specific surface area; advantageous for HEA/carbon composites; potential for large-scale production | Random orientation and non-woven morphology restrict use in devices requiring precise alignment or ordered arrays | [74,75] |
| Mechanical Alloying | Simple, low-cost, and scalable; most economical approach for producing HEA powders | Irregular powder morphology and broad size distribution; low yield; often requires post-treatment | [64,65] |
| Wet-Chemical Synthesis | Precise control over nanoparticle size, morphology, and surface state; well-suited for high-performance sensing materials | Scalability constrained by reactor volume; requires surfactant removal and post-synthesis purification; relatively higher cost | [61,62] |
| Alloy Composition | Application | Key Performance | Ref. |
|---|---|---|---|
| CoCrFeMnNi powder | Flexible strain sensor | Resistivity: 0.851 Ω·m; Tensile strength: 1.97 MPa; Elongation: 279.86%; GF: 0.917 (0–15% strain), 0.280 (15–70% strain); Response: 88 ms; Recovery: 115 ms; Stable over 11,000 cycles | [83] |
| FeCoNiMnZn fiber | Flexible strain sensor | TCR = 45.59 ppm/K; GF = 1.12 at 50% strain; Response: 310 ms; No drift over 6000 cycles; stable over wide temperature range | [86] |
| Fe NWs | Flexible strain sensor | GF = 37–53 (15–57.5% strain); Nonlinearity error: 2.45%; Hysteresis: 8.3% | [113] |
| Ga-In alloy | Flexible strain sensor | Stretchable to 100% strain; GF increases from 1.96 to 4.36 with strain; Young’s modulus: 43.3 kPa | [114] |
| AlMnPdPtAu HEA/CNT | H2sensor | Response: 103% (1 ppm H2) to 130.4% (100 ppm H2) at RT; Response time: 19 s; Recovery: 81 s; LOD: 31 ppb; Good selectivity; stable over 4 weeks at 90% RH | [90] |
| Ag-Au-Cu-Pd-Pt/MoS2 | H2sensor | Response: ~40% (ΔR/R) to 5000 ppm H2 at 80 °C; Response: 600 s; Recovery: 420 s; Stable over 0–60% RH, 1 week | [93] |
| Pd-Ni alloy film | H2sensor | Response time: 11 s to 1% H2 at RT; Stable over 90 days; Reversible over 5 cycles | [115] |
| PdAu alloy nanowire | H2sensor | Detection range: 0–20% H2; Can resolve <0.5% H2; Saturation above 10% H2 | [116] |
| FeCoNiMnCr HENA | Electrochemical (Glucose) | Sensitivity: 3043 μA·mM−1·cm−2 (0–1 mM), LOD: 132 μM; 932 μA·mM−1·cm−2 (1–13 mM); Good anti-interference; stable for 3 h | [117] |
| CoCrFeNiAl1.5 | Electrochemical (H2O2) | Sensitivity: 510.4 μA·mM−1·cm−2; Linear range: 0.05–49.95 mM; LOD: 4 μM; Response <5 s; Signal decay only 0.7% over 4000 s; RSD = 3.07% | [107] |
| NiPt alloy NPs | Electrochemical (Glucose) | Sensitivity: 1.824 μA·μM−1·cm−2 (0.5 μM-2.1 mM); 0.467 μA·μM−1·cm−2 (2.1–5.6 mM); LOD: 0.03 μM | [118] |
| AuPt alloy NPs/MoS2 | Electrochemical (H2O2) | Sensitivity: 0.1105 mA·cm−2·mM−1 (0.05–1.05 mM); 0.0690 (1.05–3.15 mM); LOD: 0.01 mM; Retains 84.6% after 50 bending cycles, 83.2% after 15 days; RSD = 8.5% | [119] |
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Chen, H.; Yu, Z.; Huang, Y.; Li, B.; Feng, F.; Jiang, Y.; Duan, Y.; Zheng, G.; Shao, Z. High-Entropy Alloys: A Review of Emerging Sensing Materials for Next-Generation Flexible Electronics. Materials 2026, 19, 2655. https://doi.org/10.3390/ma19122655
Chen H, Yu Z, Huang Y, Li B, Feng F, Jiang Y, Duan Y, Zheng G, Shao Z. High-Entropy Alloys: A Review of Emerging Sensing Materials for Next-Generation Flexible Electronics. Materials. 2026; 19(12):2655. https://doi.org/10.3390/ma19122655
Chicago/Turabian StyleChen, Huatan, Zhongyi Yu, Yang Huang, Bofeng Li, Fangting Feng, Yuming Jiang, Yuting Duan, Gaofeng Zheng, and Zungui Shao. 2026. "High-Entropy Alloys: A Review of Emerging Sensing Materials for Next-Generation Flexible Electronics" Materials 19, no. 12: 2655. https://doi.org/10.3390/ma19122655
APA StyleChen, H., Yu, Z., Huang, Y., Li, B., Feng, F., Jiang, Y., Duan, Y., Zheng, G., & Shao, Z. (2026). High-Entropy Alloys: A Review of Emerging Sensing Materials for Next-Generation Flexible Electronics. Materials, 19(12), 2655. https://doi.org/10.3390/ma19122655

