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Journal: Materials, 2026
Volume: 19
Number: 2182

Article: Low-Temperature Sintering Mechanism and Bonding Performance of Submicron Triangular Silver Paste for Advanced Electronic Packaging
Authors: by Pengrong Lin, Zirui Tong, Shimeng Xu, Yiping Wang, Shang Wang and Yanhong Tian
Link: https://www.mdpi.com/1996-1944/19/11/2182

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