Lin, P.; Tong, Z.; Xu, S.; Wang, Y.; Wang, S.; Tian, Y.
Low-Temperature Sintering Mechanism and Bonding Performance of Submicron Triangular Silver Paste for Advanced Electronic Packaging. Materials 2026, 19, 2182.
https://doi.org/10.3390/ma19112182
AMA Style
Lin P, Tong Z, Xu S, Wang Y, Wang S, Tian Y.
Low-Temperature Sintering Mechanism and Bonding Performance of Submicron Triangular Silver Paste for Advanced Electronic Packaging. Materials. 2026; 19(11):2182.
https://doi.org/10.3390/ma19112182
Chicago/Turabian Style
Lin, Pengrong, Zirui Tong, Shimeng Xu, Yiping Wang, Shang Wang, and Yanhong Tian.
2026. "Low-Temperature Sintering Mechanism and Bonding Performance of Submicron Triangular Silver Paste for Advanced Electronic Packaging" Materials 19, no. 11: 2182.
https://doi.org/10.3390/ma19112182
APA Style
Lin, P., Tong, Z., Xu, S., Wang, Y., Wang, S., & Tian, Y.
(2026). Low-Temperature Sintering Mechanism and Bonding Performance of Submicron Triangular Silver Paste for Advanced Electronic Packaging. Materials, 19(11), 2182.
https://doi.org/10.3390/ma19112182