Li, Y.; Pan, B.; Ge, Z.; Chen, P.; Bi, B.; Yi, X.; Wu, C.; Wang, C.
Soldering and Bonding in Contemporary Electronic Device Packaging. Materials 2025, 18, 2015.
https://doi.org/10.3390/ma18092015
AMA Style
Li Y, Pan B, Ge Z, Chen P, Bi B, Yi X, Wu C, Wang C.
Soldering and Bonding in Contemporary Electronic Device Packaging. Materials. 2025; 18(9):2015.
https://doi.org/10.3390/ma18092015
Chicago/Turabian Style
Li, Yuxuan, Bei Pan, Zhenting Ge, Pengpeng Chen, Bo Bi, Xin Yi, Chaochao Wu, and Ce Wang.
2025. "Soldering and Bonding in Contemporary Electronic Device Packaging" Materials 18, no. 9: 2015.
https://doi.org/10.3390/ma18092015
APA Style
Li, Y., Pan, B., Ge, Z., Chen, P., Bi, B., Yi, X., Wu, C., & Wang, C.
(2025). Soldering and Bonding in Contemporary Electronic Device Packaging. Materials, 18(9), 2015.
https://doi.org/10.3390/ma18092015