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Journal: Materials, 2025
Volume: 18
Number: 1714
1714
Article: Effect of Ni Content on the Dissolution Behavior of Hot-Dip Tin-Coated Copper Wire and the Evolution of a Cu–Sn Intermetallic Compound Layer
Authors: by Qi Wang, Jinhan Zhang, Song Niu, Jinjin Fan, Shijun Tang, Shihong Tang, Ningkang Yin, Jingxuan Liu and Mingmao Li
Link: https://www.mdpi.com/1996-1944/18/8/1714

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