Wang, Q.; Zhang, J.; Niu, S.; Fan, J.; Tang, S.; Tang, S.; Yin, N.; Liu, J.; Li, M.
Effect of Ni Content on the Dissolution Behavior of Hot-Dip Tin-Coated Copper Wire and the Evolution of a Cu–Sn Intermetallic Compound Layer. Materials 2025, 18, 1714.
https://doi.org/10.3390/ma18081714
AMA Style
Wang Q, Zhang J, Niu S, Fan J, Tang S, Tang S, Yin N, Liu J, Li M.
Effect of Ni Content on the Dissolution Behavior of Hot-Dip Tin-Coated Copper Wire and the Evolution of a Cu–Sn Intermetallic Compound Layer. Materials. 2025; 18(8):1714.
https://doi.org/10.3390/ma18081714
Chicago/Turabian Style
Wang, Qi, Jinhan Zhang, Song Niu, Jinjin Fan, Shijun Tang, Shihong Tang, Ningkang Yin, Jingxuan Liu, and Mingmao Li.
2025. "Effect of Ni Content on the Dissolution Behavior of Hot-Dip Tin-Coated Copper Wire and the Evolution of a Cu–Sn Intermetallic Compound Layer" Materials 18, no. 8: 1714.
https://doi.org/10.3390/ma18081714
APA Style
Wang, Q., Zhang, J., Niu, S., Fan, J., Tang, S., Tang, S., Yin, N., Liu, J., & Li, M.
(2025). Effect of Ni Content on the Dissolution Behavior of Hot-Dip Tin-Coated Copper Wire and the Evolution of a Cu–Sn Intermetallic Compound Layer. Materials, 18(8), 1714.
https://doi.org/10.3390/ma18081714
