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Journal: Materials, 2025
Volume: 18
Number: 1622

Article: Investigation of 2-Mercapto-1-Methylimidazole as a New Type of Leveler in Wafer Electroplating Copper
Authors: by Tong Tan, Renlong Liu, Lanfeng Guo, Zhaobo He, Xing Fan, Rui Ye and Changyuan Tao
Link: https://www.mdpi.com/1996-1944/18/7/1622

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