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Journal: Materials, 2025
Volume: 18
Number: 858

Article: Investigation of the Microstructures and Mechanical Properties of Sn-Cu-Bi-In-Ni Solders
Authors: by Xiaochun Lv, Chenghao Zhang, Yang Liu, Zhen Pan, Zhiyuan Wang and Fenglian Sun
Link: https://www.mdpi.com/1996-1944/18/4/858

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