Wang, Y.; Yang, Q.; Guo, K.; Liu, T.; Zhao, X.; Huang, L.; Ruan, H.; Zhou, X.; Chen, Y.
Interfacial Structure and Bonding Properties of Ag/Cu Through-Layered Composite Fabricated by Dual-Face Hot-Roll Inlaying Process. Materials 2025, 18, 5580.
https://doi.org/10.3390/ma18245580
AMA Style
Wang Y, Yang Q, Guo K, Liu T, Zhao X, Huang L, Ruan H, Zhou X, Chen Y.
Interfacial Structure and Bonding Properties of Ag/Cu Through-Layered Composite Fabricated by Dual-Face Hot-Roll Inlaying Process. Materials. 2025; 18(24):5580.
https://doi.org/10.3390/ma18245580
Chicago/Turabian Style
Wang, Yong, Quanzhen Yang, Kunshan Guo, Tianhao Liu, Xue Zhao, Lei Huang, Haiguang Ruan, Xiaorong Zhou, and Yi Chen.
2025. "Interfacial Structure and Bonding Properties of Ag/Cu Through-Layered Composite Fabricated by Dual-Face Hot-Roll Inlaying Process" Materials 18, no. 24: 5580.
https://doi.org/10.3390/ma18245580
APA Style
Wang, Y., Yang, Q., Guo, K., Liu, T., Zhao, X., Huang, L., Ruan, H., Zhou, X., & Chen, Y.
(2025). Interfacial Structure and Bonding Properties of Ag/Cu Through-Layered Composite Fabricated by Dual-Face Hot-Roll Inlaying Process. Materials, 18(24), 5580.
https://doi.org/10.3390/ma18245580
