Wang, S.; Jia, X.; Song, K.; Yang, H.; Xing, S.; Li, H.; Cheng, M.
Simulation of Residual Stress Around Nano-Perforations in Elastic Media: Insights for Porous Material Design. Materials 2025, 18, 5388.
https://doi.org/10.3390/ma18235388
AMA Style
Wang S, Jia X, Song K, Yang H, Xing S, Li H, Cheng M.
Simulation of Residual Stress Around Nano-Perforations in Elastic Media: Insights for Porous Material Design. Materials. 2025; 18(23):5388.
https://doi.org/10.3390/ma18235388
Chicago/Turabian Style
Wang, Shuang, Xin Jia, Kun Song, Haibing Yang, Shichao Xing, Hongyuan Li, and Ming Cheng.
2025. "Simulation of Residual Stress Around Nano-Perforations in Elastic Media: Insights for Porous Material Design" Materials 18, no. 23: 5388.
https://doi.org/10.3390/ma18235388
APA Style
Wang, S., Jia, X., Song, K., Yang, H., Xing, S., Li, H., & Cheng, M.
(2025). Simulation of Residual Stress Around Nano-Perforations in Elastic Media: Insights for Porous Material Design. Materials, 18(23), 5388.
https://doi.org/10.3390/ma18235388