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Journal: Materials, 2025
Volume: 18
Number: 5152
5152
Article: Constitutive Model of Secondary Annealing Behavior of Cu-Cu Joints in Cu/SiO₂ Hybrid Bonding
Authors: by Yiming Hao, Si Chen, Chao Li, Zejian Chen, Fei Qin, Pei Chen, Renjie Tian and Ziyang Li
Link: https://www.mdpi.com/1996-1944/18/22/5152

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