Yang, C.-T.; Huang, Y.-F.; Tien, C.-W.; Wu, K.-Y.; Huang, H.-S.; Hsiang, H.-I.
Microstructure (EBSD-KAM)-Informed Selection of Single-Powder Soft Magnetics for Molded Inductors. Materials 2025, 18, 5016.
https://doi.org/10.3390/ma18215016
AMA Style
Yang C-T, Huang Y-F, Tien C-W, Wu K-Y, Huang H-S, Hsiang H-I.
Microstructure (EBSD-KAM)-Informed Selection of Single-Powder Soft Magnetics for Molded Inductors. Materials. 2025; 18(21):5016.
https://doi.org/10.3390/ma18215016
Chicago/Turabian Style
Yang, Chang-Ting, Yu-Fang Huang, Chun-Wei Tien, Kun-Yang Wu, Hung-Shang Huang, and Hsing-I Hsiang.
2025. "Microstructure (EBSD-KAM)-Informed Selection of Single-Powder Soft Magnetics for Molded Inductors" Materials 18, no. 21: 5016.
https://doi.org/10.3390/ma18215016
APA Style
Yang, C.-T., Huang, Y.-F., Tien, C.-W., Wu, K.-Y., Huang, H.-S., & Hsiang, H.-I.
(2025). Microstructure (EBSD-KAM)-Informed Selection of Single-Powder Soft Magnetics for Molded Inductors. Materials, 18(21), 5016.
https://doi.org/10.3390/ma18215016