Order Article Reprints
Journal: Materials, 2025
Volume: 18
Number: 4074
Article:
Multi-Algorithm Ensemble Learning Framework for Predicting the Solder Joint Reliability of Wafer-Level Packaging
Authors:
by
Qinghua Su and Kuo-Ning Chiang
Link:
https://www.mdpi.com/1996-1944/18/17/4074
MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover
and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article
and designed to be complimentary to the journal.