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Journal: Materials, 2025
Volume: 18
Number: 3925
3925
Article: In Situ Observation of Deformation in a Sn-3Ag-0.5Cu/Cu Solder Joint Using High-Voltage Transmission Electron Microscopy
Authors: by Kazuhiro Nogita, Xin Fu Tan, Jiye Zhou, Stuart D. McDonald, Keith Sweatman, Flora Somidin, Guang Zeng, Hiroshi Maeno, Kazuhiro Yasuda and Christopher M. Gourlay
Link: https://www.mdpi.com/1996-1944/18/16/3925

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