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Journal: Materials, 2025
Volume: 18
Number: 3788
3788
Article: Multiscale Finite Element Analysis of Warping Suppression in Microelectronics with Graded SiC/Al Composites
Authors: by Junfeng Zhao, Junliang Zhang, Hao Su, Yu Zhang, Kai Li, Haijuan Mei, Changwei Wu, Qingfeng Zhu and Weiping Gong
Link: https://www.mdpi.com/1996-1944/18/16/3788

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