Hu, J.;                     Wang, Q.;                     Wang, K.;                     Wang, W.;                     Qiang, F.;                     Li, L.    
        Coupled Temperature–Flow Field and Microstructure Numerical Simulation of the Solidification Process for Cu-3Ti-0.2Fe Alloy. Materials 2025, 18, 2478.
    https://doi.org/10.3390/ma18112478
    AMA Style
    
                                Hu J,                                 Wang Q,                                 Wang K,                                 Wang W,                                 Qiang F,                                 Li L.        
                Coupled Temperature–Flow Field and Microstructure Numerical Simulation of the Solidification Process for Cu-3Ti-0.2Fe Alloy. Materials. 2025; 18(11):2478.
        https://doi.org/10.3390/ma18112478
    
    Chicago/Turabian Style
    
                                Hu, Jiangwei,                                 Qingjuan Wang,                                 Kuaishe Wang,                                 Wen Wang,                                 Fengming Qiang,                                 and Longxin Li.        
                2025. "Coupled Temperature–Flow Field and Microstructure Numerical Simulation of the Solidification Process for Cu-3Ti-0.2Fe Alloy" Materials 18, no. 11: 2478.
        https://doi.org/10.3390/ma18112478
    
    APA Style
    
                                Hu, J.,                                 Wang, Q.,                                 Wang, K.,                                 Wang, W.,                                 Qiang, F.,                                 & Li, L.        
        
        (2025). Coupled Temperature–Flow Field and Microstructure Numerical Simulation of the Solidification Process for Cu-3Ti-0.2Fe Alloy. Materials, 18(11), 2478.
        https://doi.org/10.3390/ma18112478