Denisiewicz, A.; Socha, T.; Kula, K.; Błażejewski, W.; Wyjadłowski, M.
Numerical Analysis of the Load-Bearing Capacity of a Thin-Walled Perforated Beam Cooperating with Chipboard Panels in a Structural System. Materials 2025, 18, 2208.
https://doi.org/10.3390/ma18102208
AMA Style
Denisiewicz A, Socha T, Kula K, Błażejewski W, Wyjadłowski M.
Numerical Analysis of the Load-Bearing Capacity of a Thin-Walled Perforated Beam Cooperating with Chipboard Panels in a Structural System. Materials. 2025; 18(10):2208.
https://doi.org/10.3390/ma18102208
Chicago/Turabian Style
Denisiewicz, Arkadiusz, Tomasz Socha, Krzysztof Kula, Wojciech Błażejewski, and Marek Wyjadłowski.
2025. "Numerical Analysis of the Load-Bearing Capacity of a Thin-Walled Perforated Beam Cooperating with Chipboard Panels in a Structural System" Materials 18, no. 10: 2208.
https://doi.org/10.3390/ma18102208
APA Style
Denisiewicz, A., Socha, T., Kula, K., Błażejewski, W., & Wyjadłowski, M.
(2025). Numerical Analysis of the Load-Bearing Capacity of a Thin-Walled Perforated Beam Cooperating with Chipboard Panels in a Structural System. Materials, 18(10), 2208.
https://doi.org/10.3390/ma18102208