Wadhwa, A.;                     Saadati, M.;                     Benavides-Guerrero, J.;                     Bolduc, M.;                     Cloutier, S.G.    
        Grain Structure Engineering in Screen-Printed Silver Flake-Based Inks for High-Temperature Printed Electronics Applications. Materials 2024, 17, 4966.
    https://doi.org/10.3390/ma17204966
    AMA Style
    
                                Wadhwa A,                                 Saadati M,                                 Benavides-Guerrero J,                                 Bolduc M,                                 Cloutier SG.        
                Grain Structure Engineering in Screen-Printed Silver Flake-Based Inks for High-Temperature Printed Electronics Applications. Materials. 2024; 17(20):4966.
        https://doi.org/10.3390/ma17204966
    
    Chicago/Turabian Style
    
                                Wadhwa, Arjun,                                 Mohammad Saadati,                                 Jaime Benavides-Guerrero,                                 Martin Bolduc,                                 and Sylvain G. Cloutier.        
                2024. "Grain Structure Engineering in Screen-Printed Silver Flake-Based Inks for High-Temperature Printed Electronics Applications" Materials 17, no. 20: 4966.
        https://doi.org/10.3390/ma17204966
    
    APA Style
    
                                Wadhwa, A.,                                 Saadati, M.,                                 Benavides-Guerrero, J.,                                 Bolduc, M.,                                 & Cloutier, S. G.        
        
        (2024). Grain Structure Engineering in Screen-Printed Silver Flake-Based Inks for High-Temperature Printed Electronics Applications. Materials, 17(20), 4966.
        https://doi.org/10.3390/ma17204966