Wadhwa, A.; Saadati, M.; Benavides-Guerrero, J.; Bolduc, M.; Cloutier, S.G.
Grain Structure Engineering in Screen-Printed Silver Flake-Based Inks for High-Temperature Printed Electronics Applications. Materials 2024, 17, 4966.
https://doi.org/10.3390/ma17204966
AMA Style
Wadhwa A, Saadati M, Benavides-Guerrero J, Bolduc M, Cloutier SG.
Grain Structure Engineering in Screen-Printed Silver Flake-Based Inks for High-Temperature Printed Electronics Applications. Materials. 2024; 17(20):4966.
https://doi.org/10.3390/ma17204966
Chicago/Turabian Style
Wadhwa, Arjun, Mohammad Saadati, Jaime Benavides-Guerrero, Martin Bolduc, and Sylvain G. Cloutier.
2024. "Grain Structure Engineering in Screen-Printed Silver Flake-Based Inks for High-Temperature Printed Electronics Applications" Materials 17, no. 20: 4966.
https://doi.org/10.3390/ma17204966
APA Style
Wadhwa, A., Saadati, M., Benavides-Guerrero, J., Bolduc, M., & Cloutier, S. G.
(2024). Grain Structure Engineering in Screen-Printed Silver Flake-Based Inks for High-Temperature Printed Electronics Applications. Materials, 17(20), 4966.
https://doi.org/10.3390/ma17204966