Wang, Y.; Xu, L.; Zhou, X.; Zhao, F.; Liu, J.; Wang, S.; Sun, D.; Chen, Q.
Direct Ink Writing of SiCN/RuO2/TiB2 Composite Ceramic Ink for High-Temperature Thin-Film Sensors. Materials 2024, 17, 3792.
https://doi.org/10.3390/ma17153792
AMA Style
Wang Y, Xu L, Zhou X, Zhao F, Liu J, Wang S, Sun D, Chen Q.
Direct Ink Writing of SiCN/RuO2/TiB2 Composite Ceramic Ink for High-Temperature Thin-Film Sensors. Materials. 2024; 17(15):3792.
https://doi.org/10.3390/ma17153792
Chicago/Turabian Style
Wang, Yusen, Lida Xu, Xiong Zhou, Fuxin Zhao, Jun Liu, Siqi Wang, Daoheng Sun, and Qinnan Chen.
2024. "Direct Ink Writing of SiCN/RuO2/TiB2 Composite Ceramic Ink for High-Temperature Thin-Film Sensors" Materials 17, no. 15: 3792.
https://doi.org/10.3390/ma17153792
APA Style
Wang, Y., Xu, L., Zhou, X., Zhao, F., Liu, J., Wang, S., Sun, D., & Chen, Q.
(2024). Direct Ink Writing of SiCN/RuO2/TiB2 Composite Ceramic Ink for High-Temperature Thin-Film Sensors. Materials, 17(15), 3792.
https://doi.org/10.3390/ma17153792