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Journal: Materials, 2024
Volume: 17
Number: 2311

Article: Effects of HiPIMS Duty Cycle on Plasma Discharge and the Properties of Cu Film
Authors: by Yongjie Ren, Heda Bai, Xincheng Liu, Jin Li and Xiangli Liu
Link: https://www.mdpi.com/1996-1944/17/10/2311

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