Next Article in Journal
Nonlinear Finite Element Model for Bending Analysis of Functionally-Graded Porous Circular/Annular Micro-Plates under Thermomechanical Loads Using Quasi-3D Reddy Third-Order Plate Theory
Next Article in Special Issue
Morphological Analyses of W/Cu Functional Graded Materials Obtained by Conventional and Spark Plasma Sintering
Previous Article in Journal
Design and Additive Manufacturing of a Passive Ankle–Foot Orthosis Incorporating Material Characterization for Fiber-Reinforced PETG-CF15
Previous Article in Special Issue
Microwave Soldering of Low-Resistance Conductive Joints—Technical and Economic Aspects
 
 

Order Article Reprints

Journal: Materials, 2023
Volume: 16
Number: 3504

Article: Study of the Solder Characteristics of IGBT Modules Based on Thermal–Mechanical Coupling Simulation
Authors: by Jibing Chen, Bowen Liu, Maohui Hu, Shisen Huang, Shanji Yu, Yiping Wu and Junsheng Yang
Link: https://www.mdpi.com/1996-1944/16/9/3504

MDPI provides article reprints in high quality with convenient shipping to destinations worldwide. The articles are printed in on premium paper with high-resolution figures. Our covers are customized to your article and designed to be complimentary to the journal. These reprints are ideal additions to your portfolio. Copy details: 135g/m2 paper, 2x stitched, full colour and glossy finish, orderable in quantities from 10 to 1000.

If you have any questions, or special requests, please write to our support team; we are happy to provide you with the information you need.

Reprint Options

If you need more than 400 copies, please contact us by e-mail (publisher@mdpi.com) and we will prepare an individual offer for you.

Order Cost and Details

Contact Person

Invoice Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop