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Journal: Materials, 2023
Volume: 16
Number: 3504

Article: Study of the Solder Characteristics of IGBT Modules Based on Thermal–Mechanical Coupling Simulation
Authors: by Jibing Chen, Bowen Liu, Maohui Hu, Shisen Huang, Shanji Yu, Yiping Wu and Junsheng Yang
Link: https://www.mdpi.com/1996-1944/16/9/3504

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