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Article

Preparation of Micro-Size Spherical Silver Particles and Their Application in Conductive Silver Paste

1
Faculty of Metallurgical and Energy Engineering, Kunming University of Science and Technology, Kunming 650093, China
2
Key Laboratory of Unconventional Metallurgy, Ministry of Education, Kunming 650093, China
3
National Local Joint Laboratory of Engineering Application of Microwave Energy and Equipment Technology, Kunming 650093, China
4
Kunming Institute of Precious Metals, Kunming 650106, China
*
Authors to whom correspondence should be addressed.
Materials 2023, 16(4), 1733; https://doi.org/10.3390/ma16041733
Submission received: 19 December 2022 / Revised: 2 February 2023 / Accepted: 17 February 2023 / Published: 20 February 2023
(This article belongs to the Special Issue Recovery of Non-ferrous Metal from Metallurgical Residues)

Abstract

In this paper, micro-size spherical silver particles were prepared by using a wet-chemical reduction method. The silver particles were characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD) and a laser particle-size analyzer. The results indicate that different types and the content of surfactants can be used to prevent the accumulation, and control the morphology and particle size distribution, of silver particles. Moreover, the morphology of silver particles was changed from polyhedral to spherical when the pH was raised from 1 to 3. Under the optimal synthesis conditions (0.1 mol/L silver nitrate, 0.06 mol/L ascorbic acid, gelatin (5% by weight of silver nitrate), pH = 1), the micro-size spherical silver particles with diameter of 5–8 μm were obtained. In addition, the resistivity of conductive silver paste that prepared with the as-synthesized spherical silver particles was discussed in detail and the average resistivity of the conductive silver paste was 3.57 × 10−5 Ω·cm after sintering at 140 °C for 30 min.
Keywords: spherical silver particle; micro-size; monodispersed; resistivity spherical silver particle; micro-size; monodispersed; resistivity

Share and Cite

MDPI and ACS Style

Li, N.; Li, J.; Wan, X.; Niu, Y.; Gu, Y.; Chen, G.; Ju, S. Preparation of Micro-Size Spherical Silver Particles and Their Application in Conductive Silver Paste. Materials 2023, 16, 1733. https://doi.org/10.3390/ma16041733

AMA Style

Li N, Li J, Wan X, Niu Y, Gu Y, Chen G, Ju S. Preparation of Micro-Size Spherical Silver Particles and Their Application in Conductive Silver Paste. Materials. 2023; 16(4):1733. https://doi.org/10.3390/ma16041733

Chicago/Turabian Style

Li, Na, Jun Li, Xiaoxi Wan, Yifan Niu, Yongwan Gu, Guo Chen, and Shaohua Ju. 2023. "Preparation of Micro-Size Spherical Silver Particles and Their Application in Conductive Silver Paste" Materials 16, no. 4: 1733. https://doi.org/10.3390/ma16041733

APA Style

Li, N., Li, J., Wan, X., Niu, Y., Gu, Y., Chen, G., & Ju, S. (2023). Preparation of Micro-Size Spherical Silver Particles and Their Application in Conductive Silver Paste. Materials, 16(4), 1733. https://doi.org/10.3390/ma16041733

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