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Journal: Materials, 2023
Volume: 16
Number: 1134

Article: Interfacial Reaction and Electromigration Failure of Cu Pillar/Ni/Sn-Ag/Cu Microbumps under Bidirectional Current Stressing
Authors: by Zhiwei Fu, Jian Chen, Pengfei Zhao, Xiaotong Guo, Qingzhong Xiao, Xing Fu, Jian Wang, Chao Yang, Jile Xu and Jia-Yue Yang
Link: https://www.mdpi.com/1996-1944/16/3/1134

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