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Journal: Materials, 2023
Volume: 16
Number: 5983
5983
Article: Enhanced Thermal Shock Resistance of High-Temperature Organic Adhesive by CF-SiCNWs Binary Phase Structure
Authors: by Tingyu Zhao, Zhengxiang Zhong, Xuanfeng Zhang, Jiangfeng Liu, Wenfang Wang, Bing Wang and Li Liu
Link: https://www.mdpi.com/1996-1944/16/17/5983

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