Zhao, T.; Zhong, Z.; Zhang, X.; Liu, J.; Wang, W.; Wang, B.; Liu, L.
Enhanced Thermal Shock Resistance of High-Temperature Organic Adhesive by CF-SiCNWs Binary Phase Structure. Materials 2023, 16, 5983.
https://doi.org/10.3390/ma16175983
AMA Style
Zhao T, Zhong Z, Zhang X, Liu J, Wang W, Wang B, Liu L.
Enhanced Thermal Shock Resistance of High-Temperature Organic Adhesive by CF-SiCNWs Binary Phase Structure. Materials. 2023; 16(17):5983.
https://doi.org/10.3390/ma16175983
Chicago/Turabian Style
Zhao, Tingyu, Zhengxiang Zhong, Xuanfeng Zhang, Jiangfeng Liu, Wenfang Wang, Bing Wang, and Li Liu.
2023. "Enhanced Thermal Shock Resistance of High-Temperature Organic Adhesive by CF-SiCNWs Binary Phase Structure" Materials 16, no. 17: 5983.
https://doi.org/10.3390/ma16175983
APA Style
Zhao, T., Zhong, Z., Zhang, X., Liu, J., Wang, W., Wang, B., & Liu, L.
(2023). Enhanced Thermal Shock Resistance of High-Temperature Organic Adhesive by CF-SiCNWs Binary Phase Structure. Materials, 16(17), 5983.
https://doi.org/10.3390/ma16175983
