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Journal: Materials, 2023
Volume: 16
Number: 4059

Article: Investigation of Microstructure and Mechanical Properties of SAC105 Solders with Sb, In, Ni, and Bi Additions
Authors: by Yaxin Gao, Xilei Bian, Xingbao Qiu, Yandong Jia, Jun Yi and Gang Wang
Link: https://www.mdpi.com/1996-1944/16/11/4059

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