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Journal: Materials, 2023
Volume: 16
Number: 4059
Article:
Investigation of Microstructure and Mechanical Properties of SAC105 Solders with Sb, In, Ni, and Bi Additions
Authors:
by
Yaxin Gao, Xilei Bian, Xingbao Qiu, Yandong Jia, Jun Yi and Gang Wang
Link:
https://www.mdpi.com/1996-1944/16/11/4059
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