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Journal: Materials, 2023
Volume: 16
Number: 3939
Article:
Hot Deformation Behavior and Processing Maps of Pure Copper during Isothermal Compression
Authors:
by
Tiantian Chen, Ming Wen, Hao Cui, Junmei Guo and Chuanjun Wang
Link:
https://www.mdpi.com/1996-1944/16/11/3939
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