Immonen, K.; Lyytikäinen, J.; Keränen, J.; Eiroma, K.; Suhonen, M.; Vikman, M.; Leminen, V.; Välimäki, M.; Hakola, L.
Potential of Commercial Wood-Based Materials as PCB Substrate. Materials 2022, 15, 2679.
https://doi.org/10.3390/ma15072679
AMA Style
Immonen K, Lyytikäinen J, Keränen J, Eiroma K, Suhonen M, Vikman M, Leminen V, Välimäki M, Hakola L.
Potential of Commercial Wood-Based Materials as PCB Substrate. Materials. 2022; 15(7):2679.
https://doi.org/10.3390/ma15072679
Chicago/Turabian Style
Immonen, Kirsi, Johanna Lyytikäinen, Janne Keränen, Kim Eiroma, Mika Suhonen, Minna Vikman, Ville Leminen, Marja Välimäki, and Liisa Hakola.
2022. "Potential of Commercial Wood-Based Materials as PCB Substrate" Materials 15, no. 7: 2679.
https://doi.org/10.3390/ma15072679
APA Style
Immonen, K., Lyytikäinen, J., Keränen, J., Eiroma, K., Suhonen, M., Vikman, M., Leminen, V., Välimäki, M., & Hakola, L.
(2022). Potential of Commercial Wood-Based Materials as PCB Substrate. Materials, 15(7), 2679.
https://doi.org/10.3390/ma15072679