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Journal: Materials, 2022
Volume: 15
Number: 1451
1451
Article: Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review
Authors: by Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Nur Syahirah Mohamad Zaimi, Andrei Victor Sandu, Petrica Vizureanu, Adam Rylski and Siti Farahnabilah Muhd Amli
Link: https://www.mdpi.com/1996-1944/15/4/1451

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